Description
COPPER BOND FLUX The Brownells Copper Bond Flux is specifically formulated for soldering applications within the 600°F to 800°F temperature range, making it an ideal companion for Hi-Temp Hi-Force 44™ Solder. This flux flows effortlessly into tight spots, ensuring thorough coverage and strong, reliable joints. Post-soldering cleanup is simplified, as the residue can be easily removed with warm water. Key Features: Optimal Temperature Range: Designed for soldering between 600°F and 800°F, aligning perfectly with Hi-Temp Hi-Force 44™ Solder requirements. Efficient Flow: Penetrates tight spaces to ensure comprehensive flux coverage and robust solder joints. Easy Cleanup: Residue cleans up effortlessly with warm water, streamlining the post-soldering process. Specifications: Container Size: 6 fl. oz. (177 mL) bottle. Incorporating the Brownells Copper Bond Flux into your soldering projects ensures effective fluxing action, leading to strong and reliable joints, especially when used in conjunction with Hi-Temp Hi-Force 44™ Solder.